常备粒径：1.3-4微米、4-8微米，30-40微米
Size: 1,3-4um. 4-8um.30-40um
用途：可作为导电料浆或导电薄膜等的基础原料。能大幅度提高导电能力和抗高温氧化能力，减少接触电阻、防止高频击穿。
Uses: can be used as a conductive material pulp or conductive film base material. Can substantially improve the electrical conductivity and oxidation resistance, reduce contact resistance, prevent high frequency breakdown
化学成份：含银量0.3-15%，包覆层为纯银，也可为客户定制特定成份的包覆层。可根据需要选择粒径和含银成份。
Chemical composition: the amount of silver is 0.3-1.5%, coated layer is sterling silver, also can be customized for the specific components of the coating layer. Can choose according to particle size and a silver component.